Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项金属表面处理技术,以其良好的耐腐蚀性广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀板合金是镀后在加熔融处理过程中通过扩散在基板与间生成的一种金属间化合物,因此,合金的生成与原板和镀都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项属表面处理技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板是镀锡后在加熔融处理程扩散在基板与锡之间生成的一种属间化物,因此,的生成与原板和镀都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为世纪初发展起来的一项金属表面处理技术,其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板合金层是镀锡后在加熔融处理过程中通过扩散在基板与锡层之间生成的一种金属间化合物,因此,合金层的生成与原板和镀层都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项属表面处理技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板是镀锡后在加熔融处理程扩散在基板与锡之间生成的一种属间化物,因此,的生成与原板和镀都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展一项金属表面处理技术,以其良好耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板合金层是镀锡后在加熔融处理过程中通过扩散在基板锡层之间生一种金属间化合物,因此,合金层生板和镀层都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初来的一项金属表面处理技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡合金层是镀锡后在加熔融处理过程中通过扩散在基与锡层之间生成的一种金属间化合物,因此,合金层的生成与镀层都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项属表面处理技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板合镀锡后在加熔融处理过过扩散在基板与锡之间生成的一种属间化合物,因此,合的生成与原板和镀都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来的一项金属理技术,以其良好的耐腐蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板金层是镀锡后在加熔融理过程中通过扩散在基板与锡层之间生成的一种金属间化物,,金层的生成与原板和镀层都有很大关系。

Thermal diffusion sherardizing is widely used by its good rust-resistance, whichwas developed as a new metal surface disposal technology at beginning of last century.

扩散渗锌作为上世纪初发展起来项金属表面处理技术,以其良好蚀性而得到广泛应用。

The alloy layer of tinplate is an intermetallic compound formed between base plate and tin coating through thermodiffusion during the treatment of heating and fusing after electrotinning.

镀锡板合金层是镀锡后在加熔融处理过程中通过扩散在基板与锡层之间生种金属间化合物,因此,合金层生与原板和镀层都有很大关系。